Hardhat Pins / Probe Tips
Hardhats are the drivers behind maximizing the full mating cycle potential of Fuzz Button®
technology. With the added advantages of full stackup retention and automatic solder mask
wiping, the Fuzz Button® / Hardhat contact system combines unsurpassed quality, value and
Hardhats are primarily intended for high mating cycle applications (up to 500,000 cycles), such
as Test Sockets, Contactors, Test Fixtures and high mating cycle repeatable interconnects.
However, in cases where Hardhats are utilized alone as Probe Tips, mating cycles can reach in
excess of 1,000,000 cycles such as might be required for Probe Card Testers, In-circuit Test
(ICT) or "Bed of Nails" Test Systems.
Hardhats are made from Gold-plated Beryllium Copper (Au/BeCu), offering high levels of
conductivity, low resistance, oxidation prevention, high current capability (up to 10 Amps
continuous), harsh environment tolerance (-60°C to 200C°) and excellent in-service life.
Standard Hardhats are available to match up with Fuzz Buttons in the diameters of .010", .015",
.020" and .030", which would meet DUT package pitches of .5mm, .65mm, .8mm/1mm and
1.27mm respectively. Hardhats are available in several tip configurations to mate with BGA,
LGA, CGA and QFN, as well as many other flip chip and chip scale packages. Custom
Hardhats are also available for differing size, material composition or application requirements,
please contact the factory for details.
How to use Hardhats
The Fuzz Button® / Hardhat stackup employs a tight tolerance counterbored hole structure, with
the smaller hole diameter on the topside. This hole structure prevents the Hardhat from coming
out the topside, as the shoulder of the Hardhat acts as a "stop". The Hardhat can then move
freely up and down within the hole and butts up against the topside of the Fuzz Button® which is
directly below it. The "rule of thumb" of topside protrusion of the Hardhat beyond the carrier
plane is .010", but may vary based on design specifics.
To load the stackup, the socket/interposer carrier is turned upside down, the Hardhats go first
into the holes, then followed with the Fuzz Buttons®. Repeat for all positions in the
socket/interposer array until done. Leaving the socket/interposer upside down, turn the PCB
upside down also. Then align the PCB with the socket/interposer and follow the provided
mounting instructions. Then you may turn the assembled socket/interposer and PCB into the
upright position. The assembled unit should be exercised with a DUT or dummy package a
minimum of 10 times to properly seat the stackup, after which you are then immediately ready to
Custom Interconnects - best in signal integrity
7790 E. Arapahoe Road
Centennial, CO 80112
For Hardhat Datasheet,
click on the picture below:
For Hardhat specs, please
click on the links below:
Point Tip Hardhat
Applications: LGA (breaks thru solder mask)
For Fuzz Button Size: .020"
.020" = 92-30707